Proved Semiconductor Fab Ability

Creative 3D Technologies invented a new method of semiconductor fab. We're leveraging lightsources from other industries, new mirror technology, and our unique perspectives & technologies to innovate and create a method of semiconductor fab that doesn't require a $1B tapeout per architecture design. In other words, 1 system can produce not only the wafers, but post-process, and package them, all-in-one machine (the job of an entire multi-$B fab done in 1 box.)\r\n\r\nEnd-result chips can be made with <2nm line widths, enabling 10/yr ahead future chip fab today. This brings techs like 10x faster analog chips for AI, next-gen chips to power datacenters, flexible chips for medical devices, & more to the modern day.